Solder Heat Shift (%)

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D017

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Time (seconds)

C01

11

REF2125

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SBAS798 – SEPTEMBER 2017

Product Folder Links: REF2125

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7 Parameter Measurement Information

7.1 Solder Heat Shift

The materials used in the manufacture of the REF2125 have differing coefficients of thermal expansion, resulting

in stress on the device die when the part is heated. Mechanical and thermal stress on the device die can cause

the output voltages to shift, degrading the initial accuracy specifications of the product. Reflow soldering is a

common cause of this error.

In order to illustrate this effect, a total of 32 devices were soldered on four printed circuit boards [16 devices on

each printed circuit board (PCB)] using lead-free solder paste and the paste manufacturer suggested reflow

profile. The reflow profile is as shown in Figure 22. The printed circuit board is comprised of FR4 material. The

board thickness is 1.65 mm and the area is 114 mm × 152 mm.

Figure 22. Reflow Profile

The reference and bias output voltages are measured before and after the reflow process; the typical shift is

displayed in Figure 23. Although all tested units exhibit very low shifts (< 0.01%), higher shifts are also possible

depending on the size, thickness, and material of the printed circuit board. An important note is that the

histograms display the typical shift for exposure to a single reflow profile. Exposure to multiple reflows, as is

common on PCBs with surface-mount components on both sides, causes additional shifts in the output bias

voltage. If the PCB is exposed to multiple reflows, solder the device in the second pass to minimize its exposure

to thermal stress.