C

18X

0.3

0.2

4.4 0.1

10X

0.6

0.4

2X

4

2.4 0.1

16X 0.5

1.05 MAX

0.05

0.00

2X

0.6

0.4

A

4.1

3.9

B

5.1

4.9

(0.2) TYP

2X (0.31)

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

9

10

18

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

7

CSD95495QVM

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SLPS671 – JUNE 2017

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Copyright © 2017, Texas Instruments Incorporated

9 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

9.1 Mechanical Drawing

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning

and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical

performance.