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Process Change/ Transfer

Qualification report n° QASO8N91

3. QUALIFICATION RESULTS

3.1 Process qualification results.

Bond Pull Test

Device

Wire size

Min

Max

Average

Stdev

Cpk

comments

TL431CD

LM358CD

1.0mil

1.0 mil

8.3g

8.5g

14.4g

12.7g

10.9

10.5

1.34

1.26

1.72

1.71

Minimum specification: 4g

Bond shear test

Device

Wire size

Min

Max

Average

Stdev

Cpk

comments

TL431CD

LM358CD

1.0mil

1.0 mil

45.0g

43.2g

65.4g

60.8g

57.2

53.1

5.72

5.04

1.94

1.92

Minimum specification: 32g

3.2 Bench Test qualification results

3.2.1 X-ray analysis

Wire sweeping conform

No glue void

3.2.2 External visual

NiPdAu plating: No exposed copper

Surface finish: Uniform stains free & uniform print

Cracks: Not visible at x10

Resin holes: not visible at x10

Other: No other visual defect

3.2.3 Scanning acoustic microscopy

No delamination.

3.2.4 Microsection

Resin holes: no void

Glue thickness: conform (min: 11.3µm, max 11.8µm)

Glue voids: no void

Die tilt: conform (0.5µm)

Die scribing: conform

NiPdAu plating thickness: conform

Package alignment : conform

3.2.5 Decapped devices

Loop height: conform

Ball size variation: conform

Bond shape: conform:

Bond centering: conform

Weld shape: conform

Weld centering: conform

Die scribing: conform

Die chipping: conform

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