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MPC9443 bảng dữ liệu(PDF) 13 Page - Motorola, Inc

tên linh kiện MPC9443
Giải thích chi tiết về linh kiện  2.5V AND 3.3V LVCMOS CLOCK FANOUT BUFFER
PDF  16 Pages
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nhà sản xuất  MOTOROLA [Motorola, Inc]
Trang chủ  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPC9443 bảng dữ liệu(HTML) 13 Page - Motorola, Inc

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MPC9443
TIMING SOLUTIONS
13
MOTOROLA
OUTLINE DIMENSIONS
FA SUFFIX
LQFP PACKAGE
CASE 932-03
ISSUE F
A
A1
Z
0.200 AB T–U
4X
Z
0.200 AC T–U
4X
B
B1
1
12
13
24
25
36
37
48
S1
S
V
V1
P
AE
AE
T, U, Z
DETAIL Y
DETAIL Y
BASE METAL
N
J
F
D
T–U
M
0.080
Z
AC
SECTION AE–AE
AD
G
0.080 AC
M
_
TOP & BOTTOM
L
_
W
K
AA
E
C
H
R
9
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
T
U
Z
AB
AC
DIM
A
MIN
MAX
7.000 BSC
MILLIMETERS
A1
3.500 BSC
B
7.000 BSC
B1
3.500 BSC
C
1.400
1.600
D
0.170
0.270
E
1.350
1.450
F
0.170
0.230
G
0.500 BSC
H
0.050
0.150
J
0.090
0.200
K
0.500
0.700
M
12 REF
N
0.090
0.160
P
0.250 BSC
L
0
7
R
0.150
0.250
S
9.000 BSC
S1
4.500 BSC
V
9.000 BSC
V1
4.500 BSC
W
0.200 REF
AA
1.000 REF
_
__
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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