MPXM2102AS datasheet(280/670 Pages) MOTOROLA

280 / 670 page

MPXA6115A MPXH6115A SERIES

3–134

Motorola Sensor Device Data

www.motorola.com/semiconductors

SURFACE MOUNTING INFORMATION

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

pad geometry, the packages will self–align when subjected to

a solder reflow process. It is always recommended to fabri-

cate boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP

2.54

0.300

7.62

Figure 5. SOP Footprint (Case 482)

inch

Figure 6. SSOP Footprint (Case 1317 and 1317A)

0.027 TYP 8X

0.69

0.053 TYP 8X

1.35

inch

0.387

9.83

0.150

3.81

0.050

1.27

TYP

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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