MPXM2102AS datasheet(583/670 Pages) MOTOROLA

583 / 670 page

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Motorola Sensor Device Data

www.motorola.com/semiconductors

PACKAGE OUTLINE DIMENSIONS (continued)

CASE 1368–01

ISSUE O

e/2

0.004 (0.1)

0.006 (0.15)

2 PLACES 4 TIPS

DETAIL G

SEATING

PLANE

NOTES:

1. CONTROLLING DIMENSION: INCH.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M–1994.

3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

0.280

0.300

7.11

7.62

INCHES

0.002

0.010

0.05

0.25

0.038

0.042

0.96

1.07

0.465

0.485

11.81

12.32

0.465

0.485

11.81

12.32

0.035

0.055

1.90

2.41

0.075

0.095

0.89

1.39

0.009

0.011

0.23

0.28

0.405

0.415

10.28

10.54

0.100 BSC

2.54 BSC

0.240

0.260

6.10

6.60

0.115

0.135

2.92

3.43

0.040

0.060

1.02

1.52

∅

GAGE

DETAIL G

.014 (0.35)

PLANE

°°

STYLE 1:

PIN 1. GND

2. +Vout

3. Vs

4. –Vout

5. N/C

6. N/C

7. N/C

8. N/C

STYLE 2:

PIN 1. N/C

2. Vs

3. GND

4. Vout

5. N/C

6. N/C

7. N/C

8. N/C

∅

0.110

0.130

2.79

3.30

0.690 BSC

17.52 BSC

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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