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MB10M bảng dữ liệu(PDF) 1 Page - SeCoS Halbleitertechnologie GmbH |
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MB10M bảng dữ liệu(HTML) 1 Page - SeCoS Halbleitertechnologie GmbH |
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1 / 2 page ![]() Elektronische Bauelemente MB10M 1000V 1.0 Amp Miniature SMD Glass Passivated Bridge Rectifiers 29-May-2014 Rev. A Page 1 of 2 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. RoHS compliant product A suffix of “-C” specifies halogen & lead-free FEATURES Halogen-free type Glass passivated chip junctions Compliance to RoHS product Leadless chip form, no lead damage Low power loss, High efficiency High current capability Plastic package has Underwriters Laboratory Flammability Classification 94V-0 APPLICATION AC/DC Power Supply Communication Equipment Lighting MECHANICAL DATA Case : Packed with FRP substrate and epoxy underfilled Terminals : Pure Tin plated (Lead-Free), solderable per MIL-STD-750, Method 2026 MARKING PACKAGE INFORMATION Package MPQ Leader Size MBCN 5K 13 inch ABSOLUTE MAXIMUM RATINGS ( T A=25℃unless otherwise specified) Parameters Symbol Rating Unit Repetitive peak reverse voltage VRRM 1000 V Average Forward Current IF(AV) 1 A Peak forward surge current, 8.3ms single half sine-wave IFSM 30 A Operating and Storage temperature range TJ, TSTG -55 ~ 150 ℃ ELECTRICAL CHARACTERISTICS (at TA=25℃unless otherwise specified) Parameters Symbol Min. Typ. Max. Unit Forward Voltage at IF = 0.4A VF - 0.9 1 V TA=25°C - 0.08 5 Repetitive peak reverse current@ VR = Max. VRRM TA=125°C IRRM - - 100 uA Current squared time t < 8.3ms I 2t - 3.74 - A 2s Thermal Resistance Junction to Ambient 1 RθJA - 130 - Thermal Resistance Junction to Case 1 RθJC - 40 - ℃/W Note: 1. On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3 x 1.3 mm) solder pads. 2. Preliminary specification. MBCN Millimeter Millimeter REF. Min. Max. REF. Min. Max. A 3.40 3.60 D 2.00 2.35 B 3.70 3.90 E 0.60 0.80 C 2.44 2.64 F 0.95 1.35 M |
Số phần tương tự - MB10M |
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Mô tả tương tự - MB10M |
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