Elektronische Bauelemente

MB08M

1000V 0.8 Amp

Miniature SMD Glass Passivated Bridge Rectifiers

27-Sep-2013 Rev. A

Page 1 of 2

http://www.SeCoSGmbH.com/

Any changes of specification will not be informed individually.

RoHS compliant product

A suffix of “-C” specifies halogen & lead-free

FEATURES

Halogen-free type

Glass passivated chip junctions

Compliance to RoHS product

Leadless chip form, no lead damage

Low power loss, High efficiency

High current capability

Plastic package has Underwriters Laboratory

Flammability Classification 94V-0

APPLICATION

AC/DC Power Supply

Communication Equipment

Lighting

MECHANICAL DATA

Case : Packed with FRP substrate and epoxy underfilled

Terminals : Pure Tin plated (Lead-Free),

solderable per MIL-STD-750, Method 2026

MARKING

PACKAGE INFORMATION

Package

MPQ

Leader Size

MBCN

5K

13 inch

Parameters

Symbol

Rating

Unit

Repetitive peak reverse voltage

1000

V

on glass-epoxy P.C.B.

1

0.5

Average Forward Current

on aluminum substrate

2

0.8

A

Peak forward surge current, 8.3ms single half sine-wave

30

A

Operating and Storage temperature range

-55 ~ 150

℃

Parameters

Symbol

Min.

Typ.

Max.

Unit

-

0.9

1

V

-

0.08

5

Repetitive peak reverse

-

-

100

uA

Current squared time t < 8.3ms

I

-

3.74

-

A

Thermal Resistance Junction to Ambient

1

-

130

-

Thermal Resistance Junction to Lead

1

-

40

-

℃/W

Note:

1.

On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3 x 1.3 mm) solder pads.

2.

On aluminum substrate P.C.B. with an area of 0.8 x 0.8" (20 x 20 mm) mounted on 0.05" x 0.05" (1.3 x 13. mm) solder pads.

3.

Preliminary specification.

MBCN

Millimeter

Millimeter

REF.

Min.

Max.

REF.

Min.

Max.

A

3.40

3.60

D

2.00

2.35

B

3.70

3.90

E

0.60

0.80

C

2.44

2.64

F

0.95

1.35

M