TAS5101

SLES039 – JUNE 2002

13

www.ti.com

MECHANICAL DATA

DAP (R-PDSO-G**)

PowerPAD

 PLASTIC SMALL-OUTLINE PACKAGE

0,25

0,75

0,50

0,15 NOM

Gage Plane

NOM

6,20

8,40

7,80

Thermal Pad

(see Note D)

38

12,60

11,10

32

Seating Plane

12,40

10,90

4073257/A 07/97

20

0,19

19

A

0,30

38

1

9,80

28

A MAX

PINS **

9,60

A MIN

DIM

1,20 MAX

10,90

11,10

30

38 PINS SHOWN

0,10

0,65

M

0,13

0

°–8°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically

and thermally connected to the backside of the die and possibly selected leads. Thermal pad size is 3,86 mm X 3,91 mm for the

32-pin TAS5101 device.

E. Falls within JEDEC MO-153

PowerPAD is a trademark of Texas Instruments.