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LM5107 bảng dữ liệu(PDF) 2 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
tên linh kiện LM5107
Giải thích chi tiết về linh kiện  100V / 1.4A Peak Half Bridge Gate Driver
PDF  10 Pages
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nhà sản xuất  NSC [National Semiconductor (TI)]
Trang chủ  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM5107 bảng dữ liệu(HTML) 2 Page - National Semiconductor (TI)

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Connection Diagrams
Ordering Information
Ordering Number
Package Type
NSC Package Drawing
Supplied As
LM5107MA
SOIC-8
M08A
Shipped in anti static rails
LM5107MAX
SOIC-8
M08A
2500 shipped as Tape & Reel
LM5107SD
LLP-8
SDC08A
1000 shipped as Tape & Reel
LM5107SDX
LLP-8
SDC08A
4500 shipped as Tape & Reel
Pin Description
Pin #
Name
Description
Application Information
SO-8
LLP-8
11
V
DD
Positive gate drive supply
Locally decouple to V
SS using low ESR/ESL capacitor located
as close to IC as possible.
2
2
HI
High side control input
The LM5107 HI input is compatible with TTL input thresholds.
Unused HI input should be tied to ground and not left open
3
3
LI
Low side control input
The LM5107 LI input is compatible with TTL input thresholds.
Unused LI input should be tied to ground and not left open.
44
V
SS
Ground reference
All signals are referenced to this ground.
5
5
LO
Low side gate driver output
Connect to the gate of the low side N-MOS device.
6
6
HS
High side source connection
Connect to the negative terminal of the bootstrap capacitor
and to the source of the high side N-MOS device.
7
7
HO
High side gate driver output
Connect to the gate of the low side N-MOS device.
8
8
HB
High side gate driver positive
supply rail
Connect the positive terminal of the bootstrap capacitor to HB
and the negative terminal of the bootstrap capacitor to HS.
The bootstrap capacitor should be placed as close to IC as
possible.
Note: For LLP-8 package it is recommended that the exposed pad on the bottom of the LM5107 be soldered to ground plane on the PCB board and the
ground plane should extend out from underneath the package to improve heat dissipation.
20130002
20130003
FIGURE 2.
www.national.com
2



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