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RT8901GS bảng dữ liệu(PDF) 9 Page - Richtek Technology Corporation

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RT8901
9
DS8901-03 October 2013
www.richtek.com
©
Copyright 2013 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
For recommended operating conditions specification, the
maximum junction temperature is 125
°C. The junction to
ambient thermal resistance
θJA is layout dependent. For
SOP-8 package, the thermal resistance
θJA is 120°C/W
on the standard JEDEC 51-7 four layers thermal test board.
The maximum power dissipation at TA =25
°C can be
calculated by following formula :
PD(MAX) = ( 125
°C - 25°C ) / (120°C/W) = 0.833W for
SOP-8 package
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance
θJA. The Figure 7 of derating curves allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation allowed.
Figure 7. Derating Curve
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
15304560
7590
105 120 135
Ambient Temperature (°C)
Four Layers PCB



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