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Product Data Sheet

STB0FS12A - Mid-Power LED

12

Rev.00, March 1, 2014

Reflow Soldering Characteristics

Caution :

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate (T

3° C/second max.

3° C/second max.

Preheat

- Temperature Min (T

- Temperature Max (T

- Time (T

100 °C

150 °C

60-120 seconds

150 °C

200 °C

60-180 seconds

Time maintained above:

- Temperature (T

- Time (t

183 °C

60-150 seconds

217 °C

60-150 seconds

Peak Temperature (T

215℃

260℃

Time within 5°C of actual Peak

Temperature (t

10-30 seconds

20-40 seconds

Ramp-down Rate

6 °C/second max.

6 °C/second max.

Time 25°C to Peak Temperature

6 minutes max.

8 minutes max.

IPC/JEDEC J-STD-020

(1) Reflow soldering is recommended not to be done more than two times

In the case of more than 24 hours passed soldering after first, LEDs will be damaged.

(2) Repairs should not be done after the LEDs have been soldered

When repair is unavoidable, suitable tools must be used.

(3) Die slug is to be soldered.

(4) When soldering, do not put stress on the LEDs during heating.

(5) After soldering, do not warp the circuit board.

Table 4. Reflow Soldering Characteristics