MC33099DWSLASHR2 datasheet(16/20 Pages) MOTOROLA

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33099

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

PACKAGE DIMENSIONS

NOTES:

DIMENSIONS ARE IN MILLIMETERS.

DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

DATUMS A AND B TO BE DETERMINED AT THE PLANE

WHERE THE BOTTOM OF THE LEADS EXIT THE

PLASTIC BODY.

THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,

PROTRUSION OR GATE BURRS. MOLD FLASH,

PROTRUSION OR GATE BURRS SHALL NOT EXCEED

0.15mm PER SIDE. THIS DIMENSION IS DETERMINED

AT THE PLANE WHERE THE BOTTOM OF THE LEADS

EXIT THE PLASTIC BODY.

THIS DIMENSION DOES NOT INCLUDE INTER-LEAD

FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND

PROTRUSIONS SHALL NOT EXCEED 0.25mm PER

SIDE. THIS DIMENSION IS DETERMINED AT THE

PLANE WHERE THE BOTTOM OF THE LEADS EXIT

THE PLASTIC BODY.

THIS DIMENSION DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED

0.62mm.

116

SEATING

PLANE

0.75

X45

0.25

0.49

16X

0.25

10.55

10.05

10.45

10.15

7.6

7.4

PIN 1 INDEX

PIN'S

NUMBER

0.25

1.0

0.4

0.32

0.23

SECTION A-A

0.35

2.65

2.35

0.25

0.10

16X

0.1 T

1.27

14X

DW SUFFIX

16-TERMINAL SOICW

PLASTIC PACKAGE

CASE 751G-04

ISSUE D

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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