TDA2EX datasheet(8/391 Pages) TI1

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TDA2EG-17

SPRS969B – AUGUST 2016 – REVISED JUNE 2017

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Terminal Configuration and Functions

4.1

Pin Diagram

Figure 4-1 shows the ball locations for the 538 plastic ball grid array (PBGA) package and isused in

conjunction with Table 4-1 through Table 4-26 to locate signal names and ball grid numbers.

Figure 4-1. CBD S-PBGA-N538 Package (Bottom View)

NOTE

The following bottom balls are not pinned out: AE4 / AE7 / AE10 / AE13 / AD5 / AD8 / AD11

/ AD14 / AC7 / AC9 / AC12 / AC14 / AC17 / AB3 / AB4 / AB5 / AB13 / AB14 / AB17 / AB20 /

AB21 / AB22 / AA14 / AA17 / AA22 / Y22 / W3 / W4 / W5 / W6 / V6 / V21 / V22 / V23 / R3 /

R4 / R5 / R6 / R21 / R22 / R23 / P6 / M3 / M4 / M5 / M6 / M21 / M22 / M23 / J3 / J4 / J5 / J6

/ J21 / J22 / J23 / F4 / F5 / F9 / F12 / F15 / F18 / F21 / F22 / E3 / E4 / E5 / E6 / E9 / E12 /

E15 / E18 / E21 / E22 / E23 / D4 / D5 / D9 / D12 / D15 / D18 / D21 / D22 / C9 / C12 / C15 /

C18.

These balls do not exist on the package.

4.2

Pin Attributes

Table 4-1 describes the terminal characteristics and the signals multiplexed on each ball. The following list

describes the table column headers:

1. BALL NUMBER:This column lists ball numbers on the bottom side associated with each signal on the

bottom.

2. BALL NAME: This column lists mechanical name from package device (name is taken from muxmode

0).

3. SIGNAL NAME:This column lists names of signals multiplexed on each ball (also notice that the name

of the ball is the signal name in muxmode 0).

NOTE

Table 4-1 does not take into account the subsystem multiplexing signals. Subsystem

multiplexing signals are described in Section 4.3, Signal Descriptions.

NOTE

In driver off mode, the buffer is configured in high-impedance.

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