LMC6044IMSLASHNOPB datasheet(2/23 Pages) TI1

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LMC6044

SNOS612D – NOVEMBER 1994 – REVISED MARCH 2013

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Absolute Maximum Ratings

(1) (2)

Differential Input Voltage

±Supply Voltage

Supply Voltage (V+

− V−)

16V

Output Short Circuit to V+

See(3)

Output Short Circuit to V−

See(4)

Lead Temperature (Soldering, 10 sec.)

260°C

Current at Input Pin

±5 mA

Current at Output Pin

±18 mA

Current at Power Supply Pin

35 mA

Power Dissipation

See(5)

Storage Temperature Range

−65°C to +150°C

Junction Temperature(5)

110°C

ESD Tolerance(6)

500V

Voltage at I/O Pin (V+)

+0.3V, (V−)

−0.3V

(1)

Absolute Maximum Ratings indicate limts beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test

conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Do not connect output to V+ when V+ is greater than 13V or reliability may be adversely affected.

(4)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 110°C. Output currents in excess of ±30 mA over long term may adversely

affect reliability.

(5)

The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(max) − TA)/θJA.

(6)

Human body model, 1.5 k

Ω in series with 100 pF.

Operating Ratings

LMC6044AI, LMC6044I

−40°C ≤ TJ ≤ +85°C

Temperature Range

Supply Voltage

4.5V

≤ V+ ≤ 15.5V

14-Pin PDIP

85°C/W

Thermal Resistance (

θJA)

(1)

14-Pin SOIC

115°C/W

Power Dissipation

See(2)

(1)

All numbers apply for packages soldered directly into a PC poard.

(2)

For operating at elevated temperatures, the device must be derated based on the thermal resistance

θJA with PD = (TJ − TA)/θJA.

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