DS868PP2

Copyright 2008 Cirrus Logic, Inc.

11

CS49DV8C Data Sheet

32-bit Audio DSP Family

5.4 Power Supply Characteristics

(Measurements performed under operating conditions.)

5.5 Thermal Data (128-Pin LQFP)

and bottom layers.

2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20% of the top

and bottom layers and 0.5-oz copper covering 90% of the internal power plane and ground plane layers.

3. To calculate the die temperature for a given power dissipation

4. To calculate the case temperature for a given power dissipation

Input leakage current (all digital pins with internal

pull-up resistors enabled, and XTI)

--

50

μA

Parameter

Min

Typ

Max

Unit

Power supply current:

PLL operating: VDDA

With external memory and most ports operating: VDDIO

1.Dependent on application firmware and DSP clock speed.

-

-

-

500

3.5

120

-

-

-

mA

mA

mA

Parameter

Symbol

Min

Typ

Max

Unit

Thermal Resistance (Junction to Ambient)

Two-layer Board1

Four-layer Board2

θ

ja

-

-

48

40

-

-

°C / Watt

Thermal Resistance (Junction to Top of Package)

Two-layer Board1

Four-layer Board2

ψ

jt

-

-

.39

.33

-

-

°C / Watt

Parameter

Symbol

Min

Typ

Max

Unit