HT7463A datasheet(13/16 Pages) HOLTEK

13 / 16 page

Rev. 1.11

August 12, 2016

HT7463A/HT7463B

Layout Consideration Guide

Toreduceproblemswithconductednoise,thereare

someimportantpointstoconsiderregardingthePCB

layout.

• Ensureallfeedbackconnectionsareshortanddirect.

Placethefeedbackresistorsandcompensation

componentsasclosetotheFBpinaspossible.

• Theinputbypasscapacitormustbeplacedcloseto

theVINpin.

• Theinductor,schottkydiodeandoutputcapacitor

traceshouldbeasshortaspossibletoreduce

conductedandradiatednoiseandincreaseoverall

efficiency.

• Keepthepowergroundconnectionasshortand

wideaspossible.

Thermal Considerations

Themaximumpowerdissipationdependsonthe

thermalresistanceoftheICpackage,thePCBlayout,

therateofthesurroundingairflowandthedifference

betweenthejunctionandambienttemperature.The

maximumpowerdissipationcanbecalculatedbythe

followingformula:

PD(MAX)=(TJ(MAX)–TA)/θJA

whereTJ(MAX)isthemaximumjunctiontemperature,

TAistheambienttemperatureandqJAisthejunction-

to-ambientthermalresistanceoftheICpackage

(220oC/WforSOT23-6)

For maximum operating rating conditions, the

maximumjunctiontemperatureis150oC.However,itis

recommendedthatthemaximumjunctiontemperature

doesnotexceed125oCinnormaloperationtomaintain

reliability.Thederatingcurveformaximumpower

dissipationisasfollows:

100

125

150

0.1

0.2

0.3

0.4

0.5

0.6

0.568W

Ambient Temperature (oC)

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