P3602ACMC datasheet(181/212 Pages) TECCOR

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has been done, Figure 5.5 shows the conversion of the cross-sectional area to the required

conductor width, dependent on the copper foil thickness of the trace.

Figure 5.5 Conductor Width versus Area

Trace Separation

Tip and Ring traces are subjected to various transient and overvoltage conditions. To

prevent arcing between traces, minimum trace separation should be maintained. UL 60950

will provide additional information regarding creepage and clearance requirements, which

are dependent on the Comparative Tracking Index (CTI) rating of the PCB, working voltage,

and the expected operating environment. See "UL 60950 3rd Edition (formerly UL 1950, 3rd

edition)" on page 4-16 of this data book.

A good rule of thumb for outside layers is to maintain a minimum of 18 mils for 1kV isolation.

Route the Tip and Ring traces towards the edge of the PCB away from areas containing

static sensitive devices.

Grounding

Although often overlooked, grounding is a very important design consideration when laying

out a protection interface circuit. To optimize its effectiveness, several things should be

considered in sequence:

1. Provide a large copper plane with a grid pattern for the Ground reference point.

2. Decide if a single-point or a multi-point grounding scheme is to be used. A single-point

(also called centralized) grounding scheme is used for circuit dimensions smaller than

one-tenth of a wavelength (

l = 300,000/frequency) and a multi-point (distributed)

grounding scheme is used for circuit trace lengths greater than one-fourth of a

wavelength.

.350

.300

.250

.030

.010

.005

.001

100 150

300

400

500

600

700

Conductor Cross-Section Area (sq mils)

30 50 70

200

250

.050

.020

.070

.100

.150

.200

(1 oz/ft

) 0.0014"

(1/2

oz/ft

) 0.0007"

(2 oz/ft

2) 0.00

28"

(3 oz/ft

2) 0.00

42"

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