ALD Series Data Sheet

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ALD15 Series DS 08Oct2015

Mechanical Drawings

Recommended Pick-up Point

Recommended PAD/Hole Pattern

0.10 [2.54]

1.10 [27.94]

1.30 [33.02]

RECOMMEND PAD LAYOUT FOR SMD VERSION

(VIEW FROM TOP SIDE OF CUSTOMER PCB)

0.10 [2.54]

1.10 [27.94]

1.30 [33.02]

RECOMMEND PAD LAYOUT FOR THROUGH HOLE

VERSION (VIEW FROM TOP SIDE OF CUSTOMER

PCB)

ØA(2X)

ØB(5X)

HOLE & PAD DIAMETER FOR CUSTOMER (RECOMMENDED)

HOLE DIAMETER (Ød) PAD DIAMETER (ØD)

ØA

ØB

Ø1.9

Ø1.3

Ø2.9

Ø2.3

TABLE1

Ø0.12 [Ø3.00](

8X)

Mechanical Drawings

Surface Mount

Through Hole

12.19

SUGGESTED PICK UP

POINT

Notes:

1. 20 MHz bandwidth. External 10 μF tant.capacitor in parallel with 0.1uF ceramic capacitor placed across + Vout and -Vout; 33 μF e-cap or equivalent placed across +Vin and -Vin.

2. Efficiency measurements taken at full load, nominal line and TA = 25 °C

3. All specifications are typical at nominal line, full load and TA = 25 °C unless otherwise noted.

4. Mechanical drawings are for reference only. Dimensions are in inches [mm]. Mechanical tolerance ± 0.020 [± 0.50]

5. Technical Reference Notes should be consulted for detailed information when available.

6. All specifications subject to change without notice.

7. Warranty two (2) years.

8. The through-hole terminated modules are intended for wave soldering process.