14. Tape & Reel Information

The devices are mounted on embossed tape for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13

inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and in-

dicate the tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association

(EIA) standard 481-1, 481-2, 481-3.

Pin 1

4

CSP32 Tape

Pin 1

Pin 1

8

4

CSP6 Tape

QFN16 Tape

epc does not guarantee that there are no empty cavities. Thus, the pick-and-place machine should check the presence of a chip during

picking.

14.1. Soldering and IC handling

Since the chip is only 50μm thick and has a high aspect ratio (length to width), a careful handling during the surface mount assembly

process shall be taken in order to avoid mechanical damage. In addition to that, careful PCB layout is needed in order to achieve reliable

assembly results with a high yield. Please refer to the application note AN04 from epc which contains comprehensive information to these

topics. This application note can be downloaded at www.espros.com/application-notes.

Item

Description

Solder balls: Alloy

Sn96.5Ag3.0Cu0.5 (SAC305)

Soldering profile

For infrared or conventional soldering, the solder profile has to follow the recommendations of

IPC/JEDEC J-STD020C (revision C and later) for lead-free assembly.

Soldering lead temperature

Allowed cleaning agents

Isopropanol

Packaging technology

Bare-die CSP with underfill

Pick and place

Nozzle

F

Z

F

SH_B

✔

✔

✔

✘

F

Z

F

SH_B

✘

✘

Vacuum

Solder ball

Chip

Figure 18: Pick & place; left: good nozzle, good picking; right: bad nozzle, bad picking

The nozzle needs a flat surface. It must not touch the pixel-field area.

It should not have any flashes where it touches the chip. The chip can get damaged.

balls during picking and placing. Refer to Figure 18, left picture. It means that it should be large

enough so that it picks the chip not just in the middle of the part but in the area above the solder balls.

Bending of the chip is not allowed. Refer toFigure 18, right picture

Keep attention having no shear forces to the solder balls during picking the chip from the tape pocket

and/or placing.

≤ 0.8 N.

≤ 0.5 N.

Preferred is forceless picking with vacuum only.

It is also highly recommended to use a „kiss-and-goodbye“ concept to place the component. It means

that the nozzle should blow the part away when it does the placing.

Table 30: IC handling specification

© 2016 ESPROS Photonics Corporation

Characteristics subject to change without notice

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