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ST8034HN bảng dữ liệu(PDF) 17 Page - STMicroelectronics

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ST8034HN, ST8034HC
Electrical characteristics
Table 9. Clock circuits
Symbol
Parameter
Test conditions(1)
Min.
Typ.
Max.
Unit
Internal oscillator
fOSC(INT)LOW
Internal oscillator frequency
Shutdown mode
100
150
200
kHz
fOSC(INT)
Active state
2
2.7
3.2
MHz
Crystal oscillator (XTAL1 and XTAL2 pins)
CEXT
External capacitances
XTAL1 and XTAL2 to GND
(according to the crystal or
resonator specification)
15
pF
fXTAL
External crystal frequency
Card clock reference,
crystal oscillator
226
MHz
fEXT
External clock frequency
External clock on XTAL1
0.032
26
MHz
tR(fEXT)
External clock frequency rise time External clock on XTAL1
10
ns
tF(fEXT)
External clock frequency fall time External clock on XTAL1
10
ns
VIL
Input voltage low
Crystal oscillator
-0.3
0.3 VDD
V
External clock on XTAL1
-0.3
0.3
VDD(INTF)
VIH
Input voltage high
Crystal oscillator
0.7 VDD
VDD + 0.3
V
External clock on XTAL1
0.7
VDD(INTF)
VDD(INTF)
+ 0.3
1. TA = 25 °C, VDD = 3.3 V, VDDP = 5 V, VDD(INTF) = 3.3 V, fXTAL = 10 MHz, unless otherwise noted.
Table 10. Protection characteristics
Symbol
Parameter
Test conditions(1)
Min.
Typ.
Max.
Unit
IOLIM
Output current limit(2)
I/O pin
-15
15
mA
CLK pin
-70
70
RST pin
-20
20
ISD(VCC)
Limit and shutdown card supply
current
VCC pin
90
120
150
mA
TSD
Shutdown junction temperature
150
°C
1. TA = 25 °C, VDD = 3.3 V, VDDP = 5 V, VDD(INTF) = 3.3 V, fXTAL = 10 MHz, unless otherwise noted.
2. All card contacts are protected against short-circuit to any other card contact.



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