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US5881LSO bảng dữ liệu(PDF) 6 Page - List of Unclassifed Manufacturers

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US5881LSO bảng dữ liệu(HTML) 6 Page - List of Unclassifed Manufacturers

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US5881 CMOS Multi-Purpose Switch
3901005881 Rev 5.0
24/July/01
Page 6
US5881
CMOS Multi-Purpose Switch
Physical Characteristics
U58
945
1
2
3
*
All Dimensions in millimeters
2.13
1.87
0.45
0.41
Marked
Surface
1.53
1.27
UA Hall Plate / Chip Location
1.60
1.40
45o
Typical
4.30
3.90
2.64
2.34
0.84
0.63
3.20
2.80
1.75
1.55
0.48
0.43
0.20
0.00
0.41
0.35
1.30
1.24
2.57
2.51
5o
Typical
45o
Typical
0.38
Typical
(see note 3)
15.5
14.5
0.41
0.35
UA Package Dimensions
* MARKING:
Line 1:
1st digit (U)
= Supplier (Melexis)
2nd and 3rd digits (58)
= Series (5880)
Line 2:
1st digit (9)
= Year (1999)
2nd and 3rd digits(45)
= Week of Year
PINOUT:
Pin 1
V
DD
Pin 2
GND
Pin 3
Output
NOTES:
1.) Controlling dimension: mm.
2.) Leads must be free of flash and
plating voids.
3.) Do not bend leads within 1mm of
lead to package interface.
4.) Package dimensions exclude
molding flash.
5.) Tolerance is +/- 0.254 mm unless
otherwise specified.
SOT-23 Hall Plate /
Chip Location
(Bottom View)
SOT-23 Package Dimensions
(Top View)
NOTES:
1. MARKING:
1st Digit (1)
= Series (1880)
2nd Digit(6)
= Year - 1996
Last Digits (51) = Week of Year
2. PINOUT (See Top View at left):
Pin 1
VDD
Pin 2
Output
Pin 3
GND
3. Controlling dimension: mm.
4. Lead thickness after solder plating will be 0.254
mm maximum.
5. Package dimensions exclude molding flash.
6. The end flash shall not exceed 0.127 mm on each
side of package.
7. Tolerance is +/- 0.254 mm unless otherwise
specified.
1.55
1.45
0.95
0.85
1651
1.30
1.00
0.10
0.00
3.10
2.70
3.00
2.60
0.50
0.35
1.80
1.50
chip
0.66
0.56
0.20
MIN
0.25
0.10
2.10
1.70
0.90
0.70
*
1
2
3
Pin #
For the latest version of this document,
Go to our website at:
WWW.melexis.com
Or for additional information
Contact Melexis Direct:
Europe and Japan
USA and rest of the world
E-mail: sales_europe@melexis.com
E-mail: sales_usa@melexis.com
Phone: 011-32-13-670-780
Phone: (603)-223-2362



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