5.78±0.20

8.23±0.20

8.15

REF.

5.18

12.57 REF.

REF.

2.51

2.11

0.29 REF.

(TYP.)

0.40

0.80 (TYP.)

C

.03

D

.03

11.50

0

±0.11

1.45±0.05

8.60

12

1.40 -0.05

0.90±0.05

2.93

13.39

±0.10

6.30

±0.10

11.80

5.35

1.14 MIN

ZLJ

D

C

B

A

A

B

C

D

ENG.REL.NO.

SCALE

SIZE

PROJECT

DWG. NO.

C

SHEET

REV.

DATE

APPROVALS

DRAWN

DESIGNED

CHECKED

QA APP'D

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN MILIMETERS

TOLERANCES ARE:

DECIMALS

ANGLES

J

OCT 4/07

ZLJ

IMPERIAL UNITS REMOVED

AUG 21/07

2

0.13

MATERIAL AND FINISH

DO NOT SCALE DRAWING

1

2

3

4

5

6

7

8

8

7

6

54

3

2

1

REVISIONS

REV.

DESCRIPTION

DATE

APPROVED

E

F

E

F

IE APP'D

DWG APP'D

TITLE

Amphenol Canada Corp.

OR USED FOR MANUFACTURING PURPOSES WITHOUT PERMISSION FROM AMPHENOL CANADA CORP.

ECN

1 OF 1

NTS

CODE IDENT. NO.

C

SFF, 26 POSITION CONNECTOR

P-FS1-R26-X000

SFF

03554

YK

YK

15/FEB/06

15/FEB/06

J

INITIAL RELEASE

APR 18/06

EAR

ML

D

PCB SOLDER PAD WIDTH REVISED FROM .010" TO .014"

FEB 19/07

ZLJ

E

TOLERANCE ADDED TO PCB HOLE & LOCATING PIN

FEB 27/07

ZLJ

F

FS1-R26-3000 ADDED

APR 05/07

ZLJ

G

H

DIAM. PEG DIM'S. ADDED, TOLERANCE ADDED TO .472

HOUSING MODIFIED

AUG10/07

.X

0.25

.XX

THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE

ZLJ

D

0.10 C

11.50

8.600

4) COMPLIES WITH SFF-8086

NOTES:

1) MATERIAL:

HOUSING: SOLDER REFLOW PROCESS COMPATIBLE LCP, UL94V-0

CONTACTS: PHOSPHOR BRONZE

2) ROHS COMPLIANT

3) PERFORMANCE:

ELECTRICAL: 0.5 AMPS MAX. PER CONTACT

MECHANICAL: 250 MATING CYCLES MINIMUM

RECOMMENDED PCB LAYOUT

NO TRACES OR INK MARKING ALLOWED

KEEPOUT ZONE IN HATCHED AREAS

A

A B

B

A

L

0.05

B

REF.

1.78 REF.

REF.

2X 1.14

±0.05

1.55

(TYP.)

±0.03

2X

(TYP.)

±0.03

±0.05

12

0.35

1.80

REF.

2.03

1

2X 1.27

1.55

PART NUMBER

PACKAGING

FS1-R26-2000

FS1-R26-3000

TAPE AND REEL

30µ" GOLD OVER 50µ" NICKEL IN CONTACT AREAS

100µ" MATTE TIN OVER 50µ" NICKEL IN SOLDER AREAS

CONTACT PLATING

15µ" GOLD OVER 50µ" NICKEL IN CONTACT AREAS

100µ" MATTE TIN OVER 50µ" NICKEL IN SOLDER AREAS