Packing description

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Packing description

Collective packing is used as STMicroelectronics qualified system for shipment of finished

wafers.

The following parts of the collective packing are used in the clean room (see Figure 3 for

detailed view):

•

Canister (composed of a base and a cover, maximum content is 25 wafers)

•

Pink foam discs (lodged below and over the stack, minimum content is 2 discs)

•

White interleaves (separators between wafers, maximum content is 26 or more for best

fit).

•

CMB bag (to protect canister under moderate vacuum)

Figure 3. Canister composition overview

Figure 4. Packed canister picture