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HSMP-381F bảng dữ liệu(PDF) 7 Page - Broadcom Corporation. |
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HSMP-381F bảng dữ liệu(HTML) 7 Page - Broadcom Corporation. |
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7 / 9 page ![]() 7 Package Dimensions Outline 23 (SOT-23) Package Characteristics Lead Material .................................................... Copper (SOT-323); Alloy 42 (SOT-23) Lead Finish ......................................................................... Tin 100% (Lead-free option) Maximum Soldering Temperature ............................................ 260°C for 5 seconds Minimum Lead Strength........................................................................... 2 pounds pull Typical Package Inductance ...................................................................................... 2 nH Typical Package Capacitance .............................................. 0.08 pF (opposite leads) Outline SOT-323 (SC-70) Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Ordering Information Specify part number followed by option. For example: HSMP - 381x - XXX Bulk or Tape and Reel Option Part Number; x = Lead Code Surface Mount PIN e B e2 e1 E1 C E XXX L D A A1 Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.79 0.000 0.30 0.08 2.73 1.15 0.89 1.78 0.45 2.10 0.45 MAX. 1.20 0.100 0.54 0.20 3.13 1.50 1.02 2.04 0.60 2.70 0.69 SYMBOL A A1 B C D E1 e e1 e2 E L e B e1 E1 C E XXX L D A A1 Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.80 0.00 0.15 0.08 1.80 1.10 1.80 0.26 MAX. 1.00 0.10 0.40 0.25 2.25 1.40 2.40 0.46 SYMBOL A A1 B C D E1 e e1 E L 1.30 typical 0.65 typical |
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