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STOD03A bảng dữ liệu(PDF) 15 Page - STMicroelectronics

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STOD03A bảng dữ liệu(HTML) 15 Page - STMicroelectronics

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DocID17785 Rev 3
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STOD03A
Application information
22
7.2
Recommended PCB layout
The STOD03A is a high frequency power switching device and therefore requires a proper
PCB layout in order to obtain the necessary stability and optimize line/load regulation and
output voltage ripple.
Analog input (VINA) and power input (VINP) must be kept separated and connected together
at the CIN pad only. The input capacitor must be as close as possible to the IC.
In order to minimize ground noise, a common ground node for power ground and a different
one for analog ground must be used. In the recommended layout, the AGND node is placed
close to CREF ground while the PGND node is centered at CIN ground. They are connected
by a separated layer routing on the bottom through vias.
The exposed pad is connected to AGND through vias.
Detailed description
Figure 14. Top layer and top silkscreen top
Figure 15. Bottom layer and silkscreen top



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