STM32L162VE datasheet(72/129 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32L162xE

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DocID025882 Rev 6

6.3.5

Wakeup time from low-power mode

The wakeup times given in the following table are measured with the MSI RC oscillator. The

clock source used to wake up the device depends on the current operating mode:

•

Sleep mode: the clock source is the clock that was set before entering Sleep mode

•

Stop mode: the clock source is the MSI oscillator in the range configured before

entering Stop mode

•

Standby mode: the clock source is the MSI oscillator running at 2.1 MHz

All timings are derived from tests performed under the conditions summarized in Table 13.

1. Data based on differential IDD measurement between all peripherals OFF an one peripheral with clock enabled, in the

following conditions: fHCLK = 32 MHz (range 1), fHCLK = 16 MHz (range 2), fHCLK = 4 MHz (range 3), fHCLK = 64kHz (Low-

power run/sleep), fAPB1 = fHCLK, fAPB2 = fHCLK, default prescaler value for each peripheral. The CPU is in Sleep mode in

both cases. No I/O pins toggling.

2. HSI oscillator is OFF for this measure.

3. Data based on a differential IDD measurement between ADC in reset configuration and continuous ADC conversion (HSI

consumption not included).

4. Data based on a differential IDD measurement between DAC in reset configuration and continuous DAC conversion of

VDD/2. DAC is in buffered mode, output is left floating.

5. Including supply current of internal reference voltage.

In Low-power sleep and run mode, the Flash memory must always be in power-down mode.

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