STM32F302XD datasheet(159/168 Pages) STMICROELECTRONICS

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STM32F302xD STM32F302xE

Package information

166

Device marking for WLCSP100

The following figure gives an example of topside marking orientation versus pin 1 identifier

location.

Other optional marking or inset/upset marks, which identify the parts throughout supply

chain operations, are not indicated below.

Figure 65. WLCSP100 marking example (package top view)

1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet

qualified and therefore not yet ready to be used in production and any consequences deriving from such

usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering

samples in production. ST Quality has to be contacted prior to any decision to use these Engineering

samples to run qualification activity.

Table 97. WLCSP100 recommended PCB design rules (0.4 mm pitch)

Dimension

Recommended values

Pitch

0.4 mm

Dpad

0.225 mm

Dsm

0.290 mm

Stencil thickness

0.1 mm

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