STM32F070F6 datasheet(79/83 Pages) STMICROELECTRONICS

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STM32F070CB/RB/C6/F6

Package information

7.4

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 20: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

•

TA max is the maximum ambient temperature in °C,

•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDD - VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

7.4.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

Table 62. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJ

Thermal resistance junction-ambient

LQFP64 - 10 mm x 10 mm

°C/W

Thermal resistance junction-ambient

LQFP48 - 7 mm x 7 mm

Thermal resistance junction-ambient

TSSOP20 - 6.5 mm x 6.4 mm

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