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L6759D bảng dữ liệu(PDF) 13 Page - STMicroelectronics |
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L6759D bảng dữ liệu(HTML) 13 Page - STMicroelectronics |
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13 / 51 page ![]() L6759D Pin description and connection diagrams Doc ID 023240 Rev 1 13/51 2.2 Thermal data Table 3. Thermal data 47 SVR_RDY VR ready. Open drain output set free after SS has finished in single-phase section and pulled low when triggering any protection for the single-phase sec- tion.Pull up to a voltage lower than 3.3 V (typ.), if not used it can be left floating. 48 ENDRV Enable driver. CMOS output driven high when the IC commands the drivers. Used in conjunction with the HiZ window on the PWMx pins to optimize the multi-phase section overall efficiency. Connect directly to external driver enable pin. PAD GND GND connection. All internal references and logic are referenced to this pin. Filter to VCC with proper MLCC capacitor and connect to the PCB GND plane. Table 2. Pin description (continued) Pin# Name Function Symbol Parameter Value Unit RthJA Thermal resistance junction to ambient (device soldered on 2s2p PC board) 40 °C/W RthJC Thermal resistance junction to case 1 °C/W TMAX Maximum junction temperature 150 °C TSTG Storage temperature range -40 to 150 °C TJ Junction temperature range 0 to 125 °C |
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