TNETV1644ZDU6 datasheet(299/306 Pages) TI1

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Mechanical Data

7.1 Thermal Data for ZWT

TMS320DM6437

Digital Media Processor

www.ti.com

SPRS345D – NOVEMBER 2006 – REVISED JUNE 2008

The following table(s) show the thermal resistance characteristics for the PBGA–ZWT and ZDU

mechanical package(s). For more details, see the Thermal Considerations for TMS320DM64xx,

TMS320DM64x, and TMS320C6000 Devices Application Report (literature number SPRAAL9).

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

5.4

N/A

ΘJB

Junction-to-board

16.0

N/A

26.6

0.00

ΘJA

Junction-to-free air

21.9

1.0

20.4

2.00

0.0

0.00

PsiJT

Junction-to-package top

0.1

1.0

0.2

2.00

15.9

0.00

PsiJB

Junction-to-board

15.8

1.0

15.3

2.00

(1)

The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC

defined 1S2P system and will change based on environment as well as application.

For more information, see these three EIA/JEDEC standards:

•

EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

(2)

m/s = meters per second

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