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STP4N80K5 bảng dữ liệu(PDF) 5 Page - STMicroelectronics

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Giải thích chi tiết về linh kiện  N-channel 800 V, 2.1 ??typ., 3 A MDmesh™K5 Power MOSFETs in DPAK, TO-220FP, TO-220 and IPAK packages
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DocID025105 Rev 3
5/23
STD4N80K5, STF4N80K5, STP4N80K5, STU4N80K5
Electrical characteristics
23
The built-in back-to-back Zener diodes have been specifically designed to enhance the ESD
capability of the device. The Zener voltage is appropriate for efficient and cost-effective
intervention to protect the device integrity. These integrated Zener diodes thus eliminate the
need for external components.
Table 6. Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
td(on)
Turn-on delay time
VDD = 400 V, ID = 1.5 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 18)
-
16.5
-
ns
tr
Rise time
-
15
-
ns
td(off)
Turn-off-delay time
-
36
-
ns
tf
Fall time
-
21
-
ns
Table 7. Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ. Max. Unit
ISD
Source-drain current
-
3
A
ISDM
(1)
1.
Pulse width limited by safe operating area
Source-drain current (pulsed)
12
A
VSD
(2)
2.
Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Forward on voltage
ISD = 3 A, VGS = 0
-
1.5
V
trr
Reverse recovery time
ISD = 3 A, di/dt = 100 A/µs
VDD= 60 V
(see Figure 20)
-242
ns
Qrr
Reverse recovery charge
-
1.42
µC
IRRM
Reverse recovery current
-
12
A
trr
Reverse recovery time
ISD = 3 A, di/dt = 100 A/µs
VDD= 60 V TJ = 150 °C
(see Figure 20)
-373
ns
Qrr
Reverse recovery charge
-
1.98
µC
IRRM
Reverse recovery current
-
10.5
A
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
V(BR)GSO
Gate-source breakdown
voltage
IGS= ± 1 mA, ID=0
30
-
V



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