TLV702

SLVSAG6C – SEPTEMBER 2010 – REVISED MARCH 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

IN

–0.3

6

EN

–0.3

6

V

OUT

–0.3

6

Current (source)

OUT

Internally limited

Output short-circuit duration

Indefinite

Total continuous power dissipation

See Thermal Information

–55

150

Temperature

°C

–55

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted).

MIN

NOM

MAX

UNIT

2

5.5

V

1.2

4.8

V

0

300

mA

6.4 Thermal Information

TLV702

DBV (SOT-23)

DSE (WSON)

UNIT

5 PINS

6 PINS

Junction-to-ambient thermal resistance

249.2

321.3

Junction-to-case (top) thermal resistance

136.4

207.9

Junction-to-board thermal resistance

85.9

281.5

°C/W

Junction-to-top characterization parameter

19.5

42.4

Junction-to-board characterization parameter

85.3

284.8

Junction-to-case (bottom) thermal resistance

N/A

142.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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