BAT960 datasheet(3/8 Pages) PHILIPS

tên linh kiện	BAT960

Giải thích chi tiết về linh kiện	Schottky barrier diode

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2003 May 01

Philips Semiconductors

Product speciﬁcation

Schottky barrier diode

BAT960

THERMAL CHARACTERISTICS

Notes

1. Refer to SOT666 standard mounting conditions.

2. Mounted on printed circuit-board, 1 cm2 copper area.

Soldering

The only recommended soldering method is reflow soldering.

CHARACTERISTICS

Tamb =25 °C unless otherwise speciﬁed.

Notes

1. Only valid, if pins 1, 2, 5 and 6 are soldered on a 1 cm2 copper solder land.

2. Pulse test: tp = 300 µs; δ = 0.02.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth j-a

thermal resistance from junction to ambient

note 1

405

K/W

note 2

215

K/W

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

continuous forward voltage

IF = 10 mA

240

270

IF = 100 mA

300

350

IF = 1000 mA; note 1; see Fig.2 480

550

reverse current

VR = 5 V; note 2

µA

VR = 8 V; note 2

µA

VR = 15 V; note 2; see Fig.3

µA

diode capacitance

VR = 5 V; f = 1 MHz; see Fig.4

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