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MMBF2201N bảng dữ liệu(PDF) 1 Page - ON Semiconductor |
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MMBF2201N bảng dữ liệu(HTML) 1 Page - ON Semiconductor |
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1 / 4 page ![]() Publication Order Number: MMBF2201NT1/D © Semiconductor Components Industries, LLC, 2013 August, 2013 − Rev. 7 1 MMBF2201N, NVF2201N Power MOSFET 300 mAmps, 20 Volts N−Channel SC−70/SOT−323 These miniature surface mount MOSFETs low RDS(on) assure minimal power loss and conserve energy, making these devices ideal for use in small power management circuitry. Typical applications are dc−dc converters, power management in portable and battery−powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. Features • Low RDS(on) Provides Higher Efficiency and Extends Battery Life • Miniature SC−70/SOT−323 Surface Mount Package Saves Board Space • NVF Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* • These Devices are Pb−Free and are RoHS Compliant MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDSS 20 Vdc Gate−to−Source Voltage − Continuous VGS ± 20 Vdc Drain Current − Continuous @ TA = 25°C − Continuous @ TA = 70°C − Pulsed Drain Current (tp ≤ 10 ms) ID ID IDM 300 240 750 mAdc Total Power Dissipation @ TA = 25°C (Note 1) Derate above 25°C PD 150 1.2 mW mW/°C Operating and Storage Temperature Range TJ, Tstg − 55 to 150 °C Thermal Resistance, Junction−to−Ambient RqJA 833 °C/W Maximum Lead Temperature for Soldering Purposes, for 10 seconds TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Mounted on G10/FR4 glass epoxy board using minimum recommended footprint. 3 1 2 N−Channel 300 mAMPS, 20 VOLTS RDS(on) = 1 W Device Package Shipping† ORDERING INFORMATION SC−70/SOT−323 CASE 419 STYLE 8 MARKING DIAGRAM AND PIN ASSIGNMENT http://onsemi.com N1 = Device Code M = Date Code* G = Pb−Free Package *Date Code orientation may vary depending upon manufacturing location. (Note: Microdot may be in either location) MMBF2201NT1G SOT−323 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 Gate 3 Drain 2 Source 2 3 1 N1 M G G NVF2201NT1G* SOT−323 (Pb−Free) 3000 / Tape & Reel |
Số phần tương tự - MMBF2201N |
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Mô tả tương tự - MMBF2201N |
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