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SN74LVC1G240DBVT bảng dữ liệu(PDF) 1 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT
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SN74LVC1G240DBVT bảng dữ liệu(HTML) 1 Page - Texas Instruments

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SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3STATE OUTPUT
SCES305H − JANUARY 2001 − REVISED OCTOBER 2003
1
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Supports 5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 3.7 ns at 3.3 V
D Low Power Consumption, 10-µA Max ICC
D ±24-mA Output Drive at 3.3 V
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This single buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
NanoStar
 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC1G240YEAR
NanoFree
 − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Reel of 3000
SN74LVC1G240YZAR
_ _ _CK_
−40 C to 85 C
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000
SN74LVC1G240YEPR
_ _ _CK_
−40
°C to 85°C
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74LVC1G240YZPR
SOT (SOT-23) − DBV
Reel of 3000
SN74LVC1G240DBVR
C40_
SOT (SOT-23) − DBV
Reel of 250
SN74LVC1G240DBVT
C40_
SOT (SC-70) − DCK
Reel of 3000
SN74LVC1G240DCKR
CK_
SOT (SC-70) − DCK
Reel of 250
SN74LVC1G240DCKT
CK_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
• = Pb-free).
Copyright
 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
OE
A
GND
VCC
Y
3
2
1
4
5
GND
A
OE
Y
VCC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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