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TMP93CS42AF bảng dữ liệu(PDF) 14 Page - Toshiba Semiconductor

tên linh kiện TMP93CS42AF
Giải thích chi tiết về linh kiện  Quality And Reliability Assurance / Handling Precautions
PDF  48 Pages
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Trang chủ  http://www.semicon.toshiba.co.jp/eng
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TMP93CS42AF bảng dữ liệu(HTML) 14 Page - Toshiba Semiconductor

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Quality and Reliability Assurance / Handling Precautions
030901
QUA-14
2002-02-20
(3)
870 Series
Table 2.5
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (1/3)
Products
Name
Air reflow
Infrared reflow
TMP87C800F
A(168h)
A(168h)
TMP87CH00F
A(168h)
A(168h)
TMP87PH00F
B(72h)
B(72h)
TMP87C800DF
A(168h)
A(168h)
TMP87CH00DF
A(168h)
A(168h)
TMP87CH00LF
A(168h)
A(168h)
TMP87PH00DF
B(72h)
B(72h)
TMP87PH00LF
A(168h)
A(168h)
TMP87C807U
A(168h)
A(168h)
TMP87C408M
A(168h)
A(168h)
TMP87C408LM
A(168h)
A(168h)
TMP87C808M
A(168h)
A(168h)
TMP87C808LM
A(168h)
A(168h)
TMP87C408DM
A(168h)
A(168h)
TMP87P808M
A(168h)
A(168h)
TMP87P808LM
A(168h)
A(168h)
TMP87C814F
A(168h)
A(168h)
TMP87CH14F
A(168h)
A(168h)
TMP87CK14F
A(168h)
A(168h)
TMP87CM14F
A(168h)
A(168h)
TMP87PM14F
B(72h)
B(72h)
TMP87CC20F
A(168h)
A(168h)
TMP87CH20F
A(168h)
A(168h)
TMP87PH20F
B(72h)
B(72h)
TMP87CK20AF
A(168h)
A(168h)
TMP87CM20AF
A(168h)
A(168h)
TMP87PM20F
B(72h)
B(72h)
TMP87CH21F
A(168h)
A(168h)
TMP87CH21BF
A(168h)
A(168h)
TMP87CH21DF
A(168h)
A(168h)
TMP87CH21BDF
A(168h)
A(168h)
TMP87CM21F
A(168h)
A(168h)
TMP87CM21DF
A(168h)
A(168h)
TMP87PP21F
B(72h)
B(72h)
TMP87PP21DF
A(168h)
A(168h)
TMP87CM23F
A(168h)
A(168h)
TMP87CP23F
A(168h)
A(168h)
TMP87PP23F
B(72h)
B(72h)
TMP87CM24AF
A(168h)
A(168h)
TMP87CP24AF
A(168h)
A(168h)
TMP87PP24AF
A(168h)
A(168h)
TMP87CH29U
A(168h)
A(168h)
TMP87CK29U
A(168h)
A(168h)
TMP87CM29U
A(168h)
A(168h)
TMP87PM29U
A(168h)
A(168h)
Note 1:
As of March, 2001
Note 2:
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G and indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device.
For
details of these conditions, please refer to Table 2.2.



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