TSOP853.., TSOP855..

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Vishay Semiconductors

Not for New Designs

Rev. 1.9, 07-Nov-13

6

Document Number: 81860

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

PACKAGE DIMENSIONS in millimeters

ASSEMBLY INSTRUCTIONS

Reflow Soldering

• Reflow soldering must be done within 72 h while stored

under a max. temperature of 30 °C, 60 % RH after

opening the dry pack envelope

• Set the furnace temperatures for pre-heating and heating

in accordance with the reflow temperature profile as

shown in the diagram. Excercise extreme care to keep the

maximum temperature below 260 °C. The temperature

shown in the profile means the temperature at the device

surface. Since there is a temperature difference between

the component and the circuit board, it should be verified

that the temperature of the device is accurately being

measured

• Handling after reflow should be done only after the work

surface has been cooled off

Manual Soldering

• Use a soldering iron of 25 W or less. Adjust the

temperature of the soldering iron below 300 °C

• Finish soldering within 3 s

• Handle products only after the temperature has cooled off

(2.2)

(4.9)

1.7 nom.

1.7 nom.

8

Not indicated to lerances ± 0.25

Proposed pad layout from component side

(dim. for reference only)

(0.6) (5x)

(R1.35)

1.7 nom

1.7 nom

0.7

(5x)

(sideview assembly)

(topview assembly)

0.8

(5x)

1.7

12

34

5

4 x 1.7 = 6.8

1.7

4 x 1.7 = 6.8

optional GND pad

connection not necessary

specifications

according to DIN

technical drawings

Drawing-No.: 6.550-5292.01-4

Issue: 3; 19.11.10

20426

Marking area

Pick and Place area

possible package deviations caused by

tolerances in the manufacturing process

either on pick and place side or solder pad side

0 - 0.1

(R1.35)

5:1