www.vishay.com

10

Document Number: 63315

S12-2345-Rev. D, 8-Oct-12

Vishay Siliconix

SiP32451, SiP32452, SiP32453

This document is subject to change without notice.

PACKAGE OUTLINE

WCSP4: 4 Bumps (2 x 2, 0.4 mm Pitch, 208 µm Bump Height, 0.8 mm x 0.8 mm Die Size)

Notes:

1. Laser mark on the backside surface of die.

2. Bumps are SAC396.

3. 0.050 max. coplanarity.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

Dimension

MILLIMETERS

INCHES

Min.

Nom.

MAX.

Min.

Nom.

MAX.

A

0.515

0.530

0.545

0.0202

0.0208

0.0214

A1

0.208

0.0081

b

0.250

0.260

0.270

0.0098

0.0102

0.0106

e

0.400

0.0157

D

0.720

0.760

0.800

0.0182

0.0193

0.0203

4 x Ø b

Bump Note 2

A

B

Index-Bump A1

W

B

A

12

1

2

A

B

Mark on backside of die

e

D

Recommended Land Pattern

All dimensions in millimeters

0.4

0.4

4 x Ø 0.150 to 0.200

Solder mask dia.