LP3995 datasheet(6/14 Pages) NSC

6 / 14 page

Electrical Characteristics (Continued)

Unless otherwise noted, V

EN = 1.5, VIN =VOUT + 1.0V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, cBP = 0.01 µF. Typical values

and limits appearing in normal type apply for T

J = 25˚C. Limits appearing in boldface type apply over the full temperature

range for operation, −40 to +125˚C. (Notes 14, 15)

Symbol

Parameter

Conditions

Typical

Limit

Units

Min

Max

DEVICE OUTPUT: 2.5

≤ V

OUT

≤ 3.3V

∆V

OUT

Output Voltage Tolerance

OUT =1mA

-2

%of

OUT(NOM)

−3

Line Regulation Error

IN =(VOUT(NOM)+1.0V) to 6.0V,

OUT =1mA

−0.1

0.1

%/V

micro SMD

Load Regulation Error

OUT =1mAto150 mA

0.0004

0.002

%/mA

LLP

Load Regulation Error

OUT =1mAto150 mA

0.002

0.005

%/mA

Dropout Voltage

OUT =1mA

0.4

OUT = 150 mA

100

PSRR

Power Supply Rejection Ratio

(Note 11)

f = 1 kHz, I

OUT =1mA

f = 10 kHz, I

OUT =1mA

FULL V

OUT RANGE

LOAD

Load Current

(Notes 10, 11)

µA

Quiescent Current

EN = 1.5V, IOUT =0mA

150

µA

EN = 1.5V, IOUT = 150 mA

140

200

EN = 0.4V

0.003

1.5

Short Circuit Current Limit

450

Output Noise Voltage ((Note 11)) BW = 10 Hz to 100 kHz,

IN = 4.2V, IOUT = 1mA

µVrms

SHUTDOWN

Thermal Shutdown

Temperature

160

˚C

Hysteresis

ENABLE CONTROL CHARACTERISTICS

Maximum Input Current at

EN Input

EN = 0.0V and VIN = 6.0V

0.001

µA

Low Input Threshold

0.4

High Input Threshold

0.9

TIMING CHARACTERISTICS

Turn On Time (Note 11)

To 95% Level (Note 12)

µs

OFF

Turn Off Time (Note 11)

To 5% Level (Note 13)

175

µs

Note 3: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device

is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical

Characteristics tables.

Note 4: All voltages are with respect to the potential at the GND pin.

Note 5: For information regarding micro SMD and LLP packages please refer to the following application notes;

AN-1112 Micro SMD Package Wafer Level Chip Scale Package,

AN-1187. Leadless Leadframe Package.

Note 6: Internal Thermal shutdown circuitry protects the device from permanent damage.

Note 7: In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated.

Maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op)), the maximum power dissipation (PD(max)), and

the junction to ambient thermal resistance in the application (

θJA). This relationship is given by :-

A(max) =TJ(max-op) −(PD(max) x

JA)

Note 8: Junction to ambient thermal resistance is highly dependant on the application and board layout. In applications where high thermal dissipation is possible,

special care must be paid to thermal issues in the board design.

Note 9: The human body model is an 100 pF discharge through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into

each pin.

Note 10: The device maintains a stable, regulated output voltage without load.

Note 11: This electrical specification is guaranteed by design.

Note 12: Time from VEN = 0.9V to VOUT = 95% (VOUT(NOM))

Note 13: Time from VEN = 0.4V to VOUT =5%(VOUT(NOM))

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