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LMH6572 bảng dữ liệu(PDF) 11 Page - National Semiconductor (TI)

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tên linh kiện LMH6572
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nhà sản xuất  NSC [National Semiconductor (TI)]
Trang chủ  http://www.national.com
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Other Applications (Continued)
POWER DISSIPATION
The LMH6572 is optimized for maximum speed and perfor-
mance in the small form factor of the standard SSOP pack-
age. To achieve its high level of performance, the LMH6572
consumes 23 mA of quiescent current, which cannot be
neglected when considering the total package power dissi-
pation limit. To ensure maximum output drive and highest
performance, thermal shutdown is not provided. Therefore, it
is of utmost importance to make sure that the T
JMAX is never
exceeded due to the overall power dissipation.
Follow these steps to determine the Maximum power dissi-
pation for the LMH6572:
1.
Calculate the quiescent (no-load) power: P
AMP =ICC*
(V
S), where VS =V
+ -V−.
2.
Calculate the RMS power dissipated in the output stage:
P
D (rms) = rms ((VS -VOUT)*IOUT), where VOUT and
I
OUT are the voltage across and the current through the
external load and V
S is the total supply voltage.
3.
Calculate the total RMS power: P
T =PAMP +PD.
The maximum power that the LMH6572, package can dissi-
pate at a given temperature can be derived with the following
equation:
P
MAX = (150˚ – TAMB)/
θ
JA, where TAMB = Ambient tempera-
ture (˚C) and
θ
JA = Thermal resistance, from junction to
ambient, for a given package (˚C/W). For the SSOP package
θ
JA is 125˚C/W.
ESD PROTECTION
The LMH6572 is protected against electrostatic discharge
(ESD) on all pins. The LMH6572 will survive 2000V Human
Body model and 200V Machine model events. Under normal
operation the ESD diodes have no effect on circuit perfor-
mance. There are occasions, however, when the ESD di-
odes will be evident. If the LMH6572 is driven by a large
signal while the device is powered down the ESD diodes will
conduct. The current that flows through the ESD diodes will
either exit the chip through the supply pins or will flow
through the device, hence it is possible to power up a chip
with a large signal applied to the input pins. Shorting the
power pins to each other will prevent the chip from being
powered up through the input.
www.national.com
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