CP Series CP2,15,06,L1,W4.5

Thermoelectric Modules

Americas: +1 888.246.9050

Europe: +46.31.420530

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

FEATURES

• Precise Temperature Control

• Compact Geometric Sizes

• Reliable Solid State Operation

• No Sound or Vibration

• Environmentally Friendly

• DC Operation

• RoHS Compliant

APPLICATIONS

• Medical Lasers

• Lab Science Instrumentation

• Clinical Diagnostic Systems

• Photonics Laser Systems

• Electronic Enclosure Cooling

• Food & Beverage Cooling

• Chillers (Liquid Cooling)

The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered

‘the standard’ in the thermoelectric industry.

This broad product line of high-performance and highly reliable TEMs is available

in numerous heat pumping capacities, geometric shapes, and input power ranges.

Assembled with Bismuth Telluride semiconductor material and thermally conductive

Aluminum Oxide ceramics, the CP Series is designed for higher current and large

heat-pumping applications.

PERFORMANCE SPECIFICATIONS

Hot Side Temperature (°C)

25

50

Qmax (Watts)

14.4

15.8

Delta Tmax (°C)

67

75

Imax (Amps)

14.0

14.0

Vmax (Volts)

1.7

1.9

Module Resistance (Ohms)

0.11

0.13

SUFFIX THICKNESS

(PRIOR TO TINNING)

FLATNESS &

PARALLELISM

HOT

FACE

COLD

FACE

LEAD

LENGTH

L1

0.180” ± 0.001”

0.001” / 0.001”

Lapped

Lapped

4.5”

L2

0.180” ± 0.0005”

0.0005” / 0.0005” Lapped

Lapped

4.5”

ML

0.186 ± 0.010”

0.002” / 0.002”

Metallized

Lapped

4.5”

LM

0.186 ± 0.010”

0.002” / 0.002”

Lapped

Metallized

4.5”

SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION

RT

RTV

White

-60 to 204 °C

Non-corrosive, silicone adhesive sealant

EP

Epoxy

Black

-55 to 150 °C

Low density syntactic foam epoxy encapsulant

SEALING OPTION