BTM430/431

Embedded Wireless Solutions Support

Center: http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

11

Laird Technologies

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

3.3

Reflow Parameters

Laird Technologies surface mount modules are designed to be easily manufactured including reflow soldering

to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to

ensure oven temperatures during reflow meet the requirements of the solder paste. Laird Technologies’

surface mount modules conform to J-STD-020D1 standards for reflow temperatures.

Important: During reflow, modules should not be above 260° and not for more than 30 seconds.

Figure 2: Recommended Reflow Temperature

Temperatures should not exceed the minimums or maximums presented in Table 6.

Table 6: Recommended Maximum and minimum temperatures

Recommended Max & Min's

SPECIFICATION

VALUE

UNIT

Temperature Inc./Dec. Rate (max)

3

°C / Sec

Temperature Decrease rate (goal)

2-3

°C / Sec

Soak Temp Increase rate (goal)

.5 - 1

°C / Sec

Flux Soak Period (Min)

60

Sec

Flux Soak Period (Max)

90

Sec

Flux Soak Temp (Min)

150

°C

Flux Soak Temp (max)

190

°C

Time Above Liquidous (max)

60

Sec

Time Above Liquidous (min)

20

Sec

Time In Target Reflow Range (goal)

30

Sec

Time At Absolute Peak (max)

30

Sec

Liquidous Temperature (SAC305)

217

°C

Lower Target Reflow Temperature

225

°C

Upper Target Reflow Temperature

250

°C

Absolute Peak Temperature

260

°C