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FPH bảng dữ liệu(PDF) 1 Page - Laird Tech Smart Technology

tên linh kiện FPH
Giải thích chi tiết về linh kiện  Foam-in-place
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nhà sản xuất  LSTD [Laird Tech Smart Technology]
Trang chủ  http://www.lairdtech.com/
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FPH bảng dữ liệu(HTML) 1 Page - Laird Tech Smart Technology

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Eccostock®FPH
High Temperature Foam-in-Place Liquid
HIGH TEMPERATURE FOAM-IN-PLACE LIQUID
Eccostock FPH is a two part closed cell foam-in-place resin system. It is a rigid, high temperature
polyurethane (isocyanate). Once cured, Eccostock FPH will withstand continuous exposure up to 135°C
(275°F) and up to 163°C (325°F) for short periods remaining rigid.
FEATURES AND BENEFITS
• Maintains rigid characteristics at high service
temperatures
• Foam-in-place
MARKETS
• Commercial Telecom
• Security and Defense
SPECIFICATIONS
TYPICAL PROPERTIES
ECCOSTOCK FPH
Bulk Density lbs/ft
3 (g/cc)
2 (0.03)
8 (0.13)
14 (0.22)
Dielectric Constant (1 MHz)
1.04
1.12
1.25
Dissipation Factor (1 MHz)
0.001
0.002
0.005
Dielectric Strength, volts/mil
40
40
40
Compressive Strength, psi (kg/cm²)
30 (2.1)
250 (17.6)
600 (42.3)
Flexural Strength at 5% strain, psi (kg/cm²)
25 (1.8)
225 (15.8)
800 (56.0)
Flexural Modulus, psi (kg/cm2)
500 (35.2)
7,000 (493)
20,000 (1408)
Tensile Strength, psi (kg/cm2)
40 (2.8)
200 (14.1)
450 (31.7)
Shear Strength, psi (kg/cm²)
35 (2.5)
140 (9.9)
300 (21.1)
Coefficient of Thermal Expansion per °C
25 x 10
-6
40 x 10
-6
50 x 10
-6
Water Absorption, % of gain in 24 hours
3
1.5
1
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
APPLICATIONS
• As Eccostock FPH maintains its rigid characteristics at high service temperatures, it is suitable for
structural applications.
• Its foam-in-place characteristic makes it an excellent choice for encapsulation applications.
• Encapsulation of electronic modules, antennas, rockets, satellites and missiles.
• Encapsulation of coiled waveguide delay line to provide rigidity
• Vibration and sound deadener when applied to interior surfaces of an instrument cabin.
• Encapsulation of crystal ovens for temperature stability.
• Staking material for high Q coils.
AVAILABILITY
Americas: +1.866.928.8181
Europe: +49.(0)8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
Size I
Size II
Size III
FPH Resin
1.3 Lbs.
5.2 Lbs.
45.4 Lbs.
Catalyst (12-2H)
0.9 Lbs.
3.4 Lbs.
29.5 Lbs.
Catalyst (12-4H)
1.0 Lbs.
3.9 Lbs.
34.1 Lbs.
Catalyst (12-6H)
1.0 Lbs.
3.9 Lbs.
34.1 Lbs.
Catalyst (12-10H)
1.1 Lbs.
4.4 Lbs.
38.6 Lbs.
Kit Availability


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