ADUCM350 datasheet(20/41 Pages) AD

20 / 41 page

Data Sheet

ADuCM350

Rev. A | Page 19 of 40

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 33.

Parameter

Rating

Supplies

VCCM_ANA, VCCM_DIG, VLCDVDD,

VDD_IO, VBACK to AGND_x/DGNDx

−0.3 V to +3.6 V

Decoupling

DVDD, AVDD_RX/TX, VBIAS, VREF, VUSB

−0.3 V to +2.0 V

Digital Input/Output

P0.x, P1.x, P2.x, P3.x, P4.x, BOOT, RESETX

−0.3 V to +3.6 V

TRACEx

−0.3 V to +3.6 V

Switch Matrix (RCAL 1, RCAL 2, AFE x)

−0.3 V to +3.6 V

TIA (TIA_I, TIA_O)

−0.3 V to +3.6 V

Analog Inputs (AN_x)

−0.3 V to +3.6 V

REF_EXCITE

−0.3 V to +1.98 V

VLCD FLY1, VLCD FLY2

−0.3 V to +3.6 V

V_LCD_13, V_LCD_23

−0.3 V to +3.6 V

VBUS to DGND

−0.3 V to +5.25 V

USB DM, USB DP to DGND

−0.3 V to +3.6 V

HF_XTALx, LF_XTALx

−0.3 V to +1.98 V

Analog Ground to Digital Ground

AGND CTOUCH, AGND_RX/TX, AGND_REF

to DGND, DGND1, DGND2, DGND USB

−0.3 V to +0.3 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages; assumes

use of a JEDEC 4-layer board.

Table 34. Thermal Resistance

Package Type

θJA

Unit

CSP_BGA

°C/W

ESD CAUTION

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