ADM7171ACPZ-1.3-R7 datasheet(22/24 Pages) AD

22 / 24 page

Data Sheet

ADM7171

Rev. C | Page 21 of 23

Figure 64. LFCSP, TA = 50°C

Figure 65. LFCSP, TA = 85°C

In the case where the board temperature is known, use the

thermal characterization parameter, ΨJB, to estimate the

junction temperature rise. Maximum junction temperature (TJ)

is calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(5)

Figure 66. LFCSP Power Dissipation for Various Board Temperatures

TYPICAL APPLICATIONS CIRCUITS

Figure 67. Clock Driver Power

Figure 68. RF PLL/VCO Power

TOTAL POWER DISSIPATION (W)

1.8

2.0

2.2

2.4

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

100

110

120

140

160

130

150

6400mm2

500mm2

25mm2

TJ MAX

TOTAL POWER DISSIPATION (W)

1.5

0.8 0.9 1.0 1.1 1.2 1.3 1.4

0.7

0.6

0.5

0.4

0.3

0.2

0.1

105

115

125

135

155

145

6400mm2

500mm2

25mm2

TJ MAX

TOTAL POWER DISSIPATION (W)

160

140

120

100

TB = 25°C

TB = 50°C

TB = 65°C

TB = 85°C

TJ MAX

ADM7171

6.5V, 1A

LDO

4V TO 6.5V

3.3V

HIGH

SPEED

CLOCK

DRIVER

ADM7171

6.5V, 1A

LDO

4V TO 6.5V

3.3V

VVCO

ADM7171

6.5V, 1A

LDO

3.3V

AVDD

DVDD

ADF4350

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