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ADA4870ARR-EBZ bảng dữ liệu(PDF) 7 Page - Analog Devices

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Giải thích chi tiết về linh kiện  Ideal for driving high capacitive or low resistive loads
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ADA4870ARR-EBZ bảng dữ liệu(HTML) 7 Page - Analog Devices

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ADA4870
Data Sheet
Rev. 0 | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
42 V
Power Dissipation
See the Power Dissipation
section and the Safe
Operating Area section
Common-Mode Input Voltage Range
VEE to VCC
Differential Input Voltage Range
±0.7 V
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range
−40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the package is limited by
the associated rise in junction temperature (TJ) on the die. At
approximately 150°C, which is the glass transition temperature,
the plastic changes its properties. Exceeding a junction temperature
of 150°C can result in changes in the silicon devices, potentially
causing failure. Table 4 shows the junction to case thermal
resistance (θJC) for the PSOP_3 package. For more detailed
information on power dissipation and thermal management,
see the Applications Information section.
Table 4. Thermal Resistance
Package Type
θJC
Unit
20-Lead PSOP_3
1.1
°C/W
ESD CAUTION



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