ADRF5130

Data Sheet

Rev. A | Page 10 of 10

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-VGGD-8.

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

SEATING

PLANE

0.90

0.85

0.80

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

24

7

12

13

18

19

6

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.30

0.25

0.18

0.20 MIN

2.85

2.70 SQ

2.55

EXPOSED

PAD

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 15. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.85 mm Package Height

(CP-24-16)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADRF5130BCPZ

−40°C to +105°C

MSL3

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-16

ADRF5130BCPZ-R7

−40°C to +105°C

MSL3

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-16

ADRF5130-EVALZ

−40°C to +105°C

Evaluation Board

1

Z = RoHS-Compliant Part.

2

See the Absolute Maximum Ratings section.

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D14081-0-1/17(A)