P9025AC-RNBGI8 datasheet(2/20 Pages) IDT

2 / 20 page

5W, QI WIRELESS POWER RECEIVER WITH INTEGRATED RECTIFIER AND LDO OUTPUT

09/01/15

P9025AC DATASHEET

Absolute Maximum Ratings

Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9025AC. These ratings,

which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these

or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the

recommended operating temperature range.

Table 1: Absolute Maximum Ratings Summary

Table 2: Package Thermal Information1,2,3,4

NOTES:

1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / ΘJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die

temperature, and the device will enter thermal shutdown.

2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions.

3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.

4. For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of

the PCB, is recommended for improving the overall thermal performance.

Table 3: ESD Information

Pins

Rating

Units

AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2 to PGND_

-0.3 to 20

BST1, BST2 to PGND1

-0.3 to (AC1, AC2 + 6)

INT, EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CHG_END/CS100, FOD1, FOD2, VDD to AGND

-0.3 to 6

PGND, PGND1, PGND2, to AGND

-0.3 to 0.3

Out Current

1.5

AC1, AC2 Current

2ARMS

Symbol

Description

Rating (VFQFPN)

Units

ΘJA

Thermal Resistance Junction to Ambient

C/W

ΘJC

Thermal Resistance Junction to Case

29.6

C/W

ΘJB

Thermal Resistance Junction to Board

2.4

C/W

Operating Junction Temperature

0 to +125

C

Ambient Operating Temperature

0 to +85

C

TSTG

Storage Temperature

-55 to +150

C

TLEAD

Lead Temperature (soldering, 10s)

300

C

Test Model

Pins

Ratings

Units

HBM

All pins

±1500

CDM

All pins

±500

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