PS7802-1A

(1) Infrared reflow soldering

• Peak reflow temperature

260 ûC (package surface temperature)

• Time of Peak reflow temperature

10 seconds or less

• Time of temperature higher than 220 ˚C

60 seconds or less

• Time to preheat temperature from 120 to 180 ˚C

120±30 s

•

Number of reflows

Three

•

Flux

Rosin ßux containing small amount of chlorine (The ßux with a max. chlorine content of 0.2 Wt % is recommended)

Recommended Temperature Profile of Infrared Reflow

RECOMMENDED SOLDERING CONDITIONS

A Business Partner of NEC Compound Semiconductor Devices, Ltd.

03/16/2004

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably

be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify CEL for all damages resulting from such improper use or sale.

(heating)

t0 10 s

180

ºC

120

ºC

120±30 s

(preheating)

Time (s)

260

ºC MAX.

220

ºC

to 60 s

(2) Wave soldering

• Temperature

260 ûC or below (molten solder temperature)

• Time

10 seconds or less

•

Preheating conditions

120ûC or below (package surface temperature)

•

Number of times

One

•

Flux

Rosin ßux containing small amount of chlorine (The ßux with a max. chlorine content of 0.2 Wt % is

recommended.)

(3) Cautions

• Fluxes

Avoid removing the residual ßux with freon-based and chlorine-based cleaning solvent.